1.板材Plate:AL 5052、3003、1060 2.厚度Thickness:1.0-3.0MM 3.銅箔厚度Copper:1OZ~2OZ 4.阻焊Solder mask:感光油墨,耐高溫,耐黃變 bright ink, heat resistant, yellowing resistance 5.表面工藝Surface Finish:OSP,HASL,Lead-free HASL 6.外型Shaping:CNC/V-CUT、模沖punching 7.電氣性能Electrical Performance:100% AOI testing